Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
FinFET technology is a three-dimensional transistor architecture that results in higher-performing and lower power chips used in mobile, computing and networking applications. Designs implemented ...
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