Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
Dialing in nanosecond pulses to cleanly cut silicon wafers. Focused on edge quality, thermal effects, and process repeatability. FEMA denies aid to Arizona counties after disastrous monsoon floods Man ...
BOSTON, MA, UNITED STATES, April 16, 2025 /EINPresswire.com/ -- UniversityWafer, Inc., a leading global supplier of advanced semiconductor substrates, is proud to ...
Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...
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What Laser Cutting a Silicon Wafer REALLY Looks Like
Micromachining silicon with lasers (but no sharks)! Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser Rob Reiner’s son Nick ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
Research from the Chin-Yi University of Technology in Taiwan revealed a novel heater design in the Czochralski silicon crystal growth process that can control and decrease oxygen concentration without ...
A rare hexagonal silicon crystal has been synthesised into a new form of silicon that can emit light 1, harnessing the energy of photons with potential for use in solar cells and computers.
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