The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...
Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of ...
Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance, driven by applications like ChatGPT based on large language models (LLMs). This requires ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced that GLink 2.3LL (GUC's die-to-die Link) interface IP for TSMC CoWoS and InFO chiplets integration platforms passed silicon validation ...
Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex ...
HAIFA, Israel, Oct. 26, 2022 /PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced the results of its collaboration with advanced ASIC provider, ...
Partnership solidifies proteanTecs' commitment to supporting Japan's high performance computing industry and the global 2.5D and 3D advanced packaging ecosystem HAIFA, Israel, Dec. 20, 2022 ...
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