Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

At Direct Connect, Intel (INTC) Foundry shares process technology roadmap, advanced packaging momentum and ecosystem partnerships. SAN JOSE, Calif.--(BUSINESS WIRE)-- Today at Intel Foundry Direct ...

Since 2021, Intel has pledged over $100 billion towards global manufacturing expansion, anchored by significant new fabs in ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...

Intel Corporation (NASDAQ:INTC) is one of the best high volume stocks to buy right now. On December 16, Bank of America raised the firm’s price target on Intel to $40 from $34, while keeping an ...

Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service providers like ...

At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and next-gen computing, ...

Tata Group and Intel Corporation have signed a Memorandum of Understanding to explore a strategic collaboration focused on semiconductor manufacturing, advanced packaging, and hardware enablement for ...

Intel’s recent 22% surge follows Nvidia’s $5 billion investment and signals market confidence in its AI-focused turnaround. The partnership validates Intel’s advanced packaging, IDM 2.0 strategy, and ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company ...