Philips Semiconductors, a division of Royal Philips Electronics (nyse:PHG), has developed a silicon BiCMOS process to manufacture RF chips for applications like third generation (3G) mobile phones.

Philips Semiconductors has announced the launch of a new RF sub-system designed for GSM triple band applications Philips Semiconductors has designed the new RF sub-system aiming to address handset ...

Philips is targeting a technology for integrating passive components in to silicon devices at mobile handset RF design. The aim of the technique, said the company, is to reduce size and cost as well ...

Royal Philips Electronics on June 20 introduced a new range of high-sensitivity digital terrestrial tuner modules. This new range makes use of Philips RF technology and competencies, resulting in what ...