Product Briefing Outline: ACI-ecotec GmbH & Co. KG has developed a new inline wafer separation system suitable for separating mono- and polycrystalline wafers in all common formats with thicknesses of ...

Product Briefing Outline: Due to technology partnerships and longtime experience RENA has been able to optimize the handling and process sequence for the complete process chain after wafer sawing with ...

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...

IMEC and Vrije Universiteit Brussel (VUB) built and demonstrated an on-wafer liquid phase chromatograph using sub-micron micromachining at last week's IEEE International Electron Devices Meeting. IMEC ...

The move follows a corporate and geopolitical dispute that led the Netherlands to suspend wafer supplies to the Chinese unit, ...

The Chinese unit of Netherlands-based Nexperia has locked in supplies of silicon wafers from local firms to cover its entire ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...