By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...

The four-day CES 2026 has officially come to a close. As a technology industry showcase defined by "AI Everywhere," the event ...

A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart ...

Rockchip unveiled two RK182X LLM/VLM accelerators at its developer conference last July, namely the RK1820 with 2.5GB RAM for ...

Courtesy of the complex routing and network configurations that Cloudflare uses, their engineers like to push the Linux ...

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise ...

DALLAS, Texas, Jan. 6, 2026 /PRNewswire/ -- SnapInspect has announced the release of a full property maintenance stack ...

Nvidia released a comprehensive robotics ecosystem at CES 2026, combining open foundation models, simulation tools, and edge hardware in a bid to become the default platform for generalist ...

Binocular Full-Color AR Glasses Reference Design "Rubis" Debuts with Tri-Chip Architecture and EMG Interaction The path to mainstream adoption of consumer AI-powered AR glasses has been hindered by ...

Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.

MDM's latest whitepaper provides practical case study examples to show what technology debt looks like in practice and how ...